Customers often ask the custom pcb assembly manufacturer when processing custom pcb assembly, do we need to do glue dispensing process for our products? At this time, we will communicate with the customer and determine whether to do the dispensing process based on the actual use of the product in th
Custom PCB assembly is the key manufacturing process for the production of circuit boards. The processing technology mainly includes two major processes: PCB manufacturing and SMT patch processing. There is still one type of thing missing, that is, electronic devices. Electronic devices are a basic
The high-speed and high-precision SMT placement machine is an indispensable foundation for PCBA quality control. As the leading custom PCB assembly manufacturer in China, Giant provides pcb assembly services china, uses a high-speed placement machine with a maximum accuracy of 01005, ensuring accura
Giant is a professional custom PCB assembly manufacturer in China. There are many customers all over the world. In the process of PCB assembly manufacturing, SMT chip processing is used. Engineers often need to calculate product processing fees, so how to calculate SMT processing fees? 1. Understand
Giant is a custom PCB Assembly manufacturer that provides custom PCB Assembly services. We have more than 10 years of experience in this industry and can meet all your requirements. We provide competitive prices and good services, we have competitive prices and good services and accept custom PCB As
PCBA is the abbreviation of Printed Circuit Board Assembly in English, which means that the empty PCB board is loaded by SMT, and then goes through the entire process of DIP plug-in.The core part of all electronic products is composed of PCBA; all functions are realized without PCB assembly. Taking
SMT-Surface Mounting TechnologyIt is a kind of surface assembly components without leads or short leads (SMC/SMD for short, chip components in Chinese) mounted on the surface of a printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates. Circuit assembly technology for w
