Views: 42 Author: Site Editor Publish Time: 2021-12-08 Origin: Site
In the custom pcb assembly processing, smt chip components are particularly small in size and light in weight, and chip components are easier to solder than lead components. SMD components also have a very important advantage, that is, to improve the stability and reliability of the circuit, which is to increase the success rate of production for pcba processing. This is because the chip components have no leads, thereby reducing stray electric fields and stray magnetic fields, which is especially obvious in high-frequency analog circuits and high-speed digital circuits.
The method of soldering smt patch components is: put the components on the pads, and then apply the adjusted patch solder paste on the contact between the component pins and the pads (be careful not to apply too much to prevent short circuits), and then Use a 20W internally heated electric soldering iron to heat the connection between the pad and the smt chip component (the temperature should be 220~230℃). When the solder is melted, the soldering iron can be removed, and the soldering is completed when the solder is solidified. After soldering, you can use tweezers to clamp the soldered patch component to see if there is any looseness. If there is no looseness (it should be very strong), it means that the soldering is good.
The method of soldering smt lead components: When starting to solder all the pins, add solder to the tip of the soldering iron, and apply flux to all the pins to keep the pins moist. Touch the end of each pin of the chip with the tip of the soldering iron until you see the solder flowing into the pin. Keep the tip of the soldering iron parallel to the soldered pin during pcba processing and soldering to prevent overlap due to excessive soldering.
After soldering all the pins, wet all the pins with flux to clean the solder. Absorb the excess solder where needed to eliminate any short circuits and overlaps. Finally, use tweezers to check whether there is any false soldering. After the inspection is completed, remove the flux from the circuit board, soak the hard brush with alcohol and wipe it carefully along the pin direction until the flux disappears.